А
Не
Всё равно там в спеках указывается жор
А не тепло
TDP is about thermal watts, not electrical watts. These are not the same.
TDP is the final product in a formula that specifies to cooler vendors what thermal resistance is acceptable for a cooler to enable the manufacturer-specified performance of a CPU.
Thermal resistance for heatsinks is rated in a unit called θca ("Theta C A"), which represents degrees Celsius per watt.
Specifically, θca represents thermal resistance between the CPU heatspreader and the ambient environment.
The lower the θca, the better the cooler is.
The θca rating is an operand in an equation that also includes optimal CPU temp and optimal case ambient temp at the "inlet" to the heatsink. That formula establishes the TDP.
Here's the TDP formula:
TDP (Watts) = (tCase°C - tAmbient°C)/(HSF ϴca)
tCase°C: Optimal temperature for the die/heatspreader junction to achieve rated performance.
tAmbient°C: Optimal temperature at the HSF fan inlet to achieve rated performance.
HSF ϴca (°C/W): The minimum °C per Watt rating of the heatsink to achieve rated performance.
Using the established TDP formula, we can compute for the 180W 1950X:
(56° – 32°)/0.133 = 180W TDP
tCase°C: 56°C optimal temperature for the processor lid.
tAmbient°C: 32°C optimal ambient temperature for the case at HSF inlet.
HSF ϴca (°C/W): 0.133 ϴca
0.133 ϴca is the objective AMD specification for cooler thermal performance to achieve rated CPU performance.
In other words, we recommend a 0.133 ϴca cooler for Threadripper and a 56C optimal CPU temp for the chip to operate as described on the box. Any cooler that meets or beats 0.133 ϴca can make this possible. But notice that power consumption isn't part of this formula at all.
Notice also that this formula allows you to poke things around: a lower ϴca ("better cooler") allows for a higher optimal CPU temp. Or a higher ϴca cooler can be offset by running a chillier ambient environment. If you tinker with the numbers, you now see how it's possible for all sorts of case and cooler designs to achieve the same outcome for users. That's the formula everyone unknowingly tinkers with when they increase airflow, or buy a beefy heatsink.
The point, here, is that TDP is a cooler spec to achieve what's printed on the box. Nothing more, nothing less, and power has nothing to do with that. It is absolutely possible to run electrical power in excess of TDP, because it takes time for that electrical energy to manifest as excess heat in the system. That heat can be amortized over time by wicking it into the silicon, into the HSF, into the IHS, into the environment. That's how you can use more electrical energy than your TDP rating without breaking your TDP rating or affecting your thermal performance.
